2010
ISO-13485Medical Devices - Quality Management Systems
2006
ISO 9001 UL approved of PCB Production facility
2003•NOW
A new Branch company established
2008
ISO-14001 to serve our customers the best we can.
Company Profile
Main Business：
1. Chip-on-board wire bonding
2. SMT assembly
3. Wave Soldering assembly
4. Casing assembly
5. RoHS compliant assembly
No. of Employees：
Production 380
Supporting staff 50
Factory area： 1,300m²
Production Capacity：
1.COB Wire Bonding: 215KK wires/M
2.SMT Assembly: 50KK chips/M
3.Wave Soldering Assembly: 10KK pcs./M
4.RoHS compliant SMT Assembly: 10KK chips/M
5.RoHS compliant Wave Soldering Assembly: 10KK pcs./M
PCBA Process Capalbility
COB Wire Bonding：
SMT Assembly：
Maximum number of wires per die: 1,500
Maximum number of wires per PCB: 10,000
Maximum number of dice per PCB: 256
Multiple die bonding maximum area: 150mm x 230mm
Minimum IC bonding pad size: 0.055mm x 0.065mm
Minimum PCB bonding pad size: 0.10mm x 0.15mm
Lowest epoxy coating height: 0.3mm above die
Maximum PCB size： 410mm x 360mm
Maximum component size： 23.5mm x 33.5mm
Minimum component size (0201)： 0.05mm x 0.025mm
QFP minimum lead pitch： 0.5mm
Maximum no. of component
Types (in 8mm tape feeders)： 80
Maximum component tape width： 56mm
PCB Capability INCH
Layer Count 2-18L
Max Working Panel Size 24”36”
Min./Max. Core Thickness 0.004”-0.300”
Inner Layer Min. Line/Space Width 0.003”/0.003”
Outer layer Min. Line/Space Width 0.003”/0.003”
Min. Drill Size for PTH (Mechanical) 0.006”
Blind via (mechanical drilling) + buried via
Max Aspect Ratio 11:1
Layer To Layer Registration ±0.002”
Routing Tolerance ±0.006”
Impedance Control Tolerance 28Ω↑ ±10%
PCB HDI Specification
Layer Count 16L
Finished board thickness 3mm
Laser Prepreg Thickness 35”
Laser Prepreg 1027
Inner Layer Min. Line/Space Width 0.0015”/0.0015”
Outer layer Min. Line/Space Width 0.002”/0.002”
Blind via (mechanical drilling) + buried via
Max Aspect Ratio 10:1
Blind Hole 0.003”
Buried hole 0.15mm
Through Hole 0.2-6.35mm
PCBA Equipment Descriptions
PCB Equipment Descriptions
2003•NOW
A new Branch company established
2006
ISO 9001 UL approved of PCB Production facility
2008
ISO-14001 to serve our customers the best we can.
2010
ISO-13485Medical Devices - Quality Management Systems
Products Category:
Netcom, Automobile, Medical Equipment, Security
PCB Assembly Services
(Through-hole, SMT, BGA, LGA )
Inductstrial PCBA -- Controller board
IoT PCBA
Wire Bonding & COB Services
Inductstrial PCBA -- Controller board
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